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US 2006/0135694 A1Published application
Hot melt adhesive composition
OwnerSteven Vaughan, Carlos Briseno +1inventors
InventorsSteven Vaughan, Carlos Briseno, Merilee Reski
Life of this patent
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Abstract
A hot melt adhesive composition includes ethylene vinyl acetate copolymer(s) having average vinyl acetate content of from about 10% to about 30%, styrene-ethylene-butylene-styrene block copolymer, tackifying resin, and optionally, a plasticizer or a wax.
Claims20
A hot melt adhesive composition comprising:
- ethylene-vinyl acetate copolymer(s) having average vinyl acetate content of from about 10% to about 30% based upon the weight of the copolymer(s);
- styrene-ethylene-butylene-styrene block copolymer(s) having average styrene content of from about 10% to about 25% based upon the weight of the copolymer;
- and
- a tackifying resin;
- provided that if one of the average vinyl acetate content and the average styrene content is no less than about 20%, the other of the average vinyl acetate content and the average styrene content is no greater than about 20%.
2 more elements
A hot melt adhesive composition comprising:
- ethylene-vinyl acetate copolymer(s) having average vinyl acetate content of from about 10% to about 30% based upon the weight of the copolymer and a melt index of no less than 40;
- styrene-ethylene-butylene-styrene block copolymer(s) having average styrene content of from about 10% to about 30% based on the weight of the copolymer;
- and
- a tackifying resin.
1 more element
A hot melt adhesive composition comprising:
- ethylene-vinyl acetate copolymer(s) having average vinyl acetate content of from about 10% to about 20% based upon the weight of the copolymer(s);
- styrene-ethylene-butylene-styrene block copolymer having a peak weight molecular weight of no greater than about 90,000 and styrene content of from about 25% to about 30% based upon the weight of the block copolymer;
- a tackifying resin;
- and
- a plasticizer.
2 more elements
Dependencies are inferred from the claim text.