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US 2006/0135687 A1Published application
Thermoconductive silicone composition
AssigneeDow Corning Toray Co., Ltd.
InventorHiroshi Fukui
Life of this patent
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Abstract
A thermoconductive silicone composition comprising: (A) an organopolysiloxane (excluding component (C)), (B) a thermoconductive filler, and (C) at least two organopolysiloxanes as defined by the following general formula that have different values for the subscript n (I), wherein each R1 is independently selected from monovalent hydrocarbon groups; R2 is an oxygen atom or divalent hydrocarbon group; R3 is an alkyl, alkoxyalkyl, alkenyl, or acyl; n is an integer from 5 to 100; and a is an integer from 1 to 3.
Claims15
A composition comprising:
- (A) an organopolysiloxane, wherein component (A) excludes component (C),
- (B) a thermoconductive filler, and
- (C) at least two organopolysiloxanes as defined by the following general formula that have different values for the subscript n
- wherein each R1 is independently selected from monovalent hydrocarbon groups;
- R2 is an oxygen atom or divalent hydrocarbon group;
- R3 is an alkyl, alkoxyalkyl, alkenyl, or acyl;
- n is an integer from 5 to 100;
- and a is an integer from 1 to 3.
5 more elements
Dependencies are inferred from the claim text.