Method for improving filler dispersal and reducing tensile modulus in a thermally conductive polymer composition

A thermally conductive polymer composition comprising:

• a thermally conductive initial mixture including:
• between 70% and 90% thermally conductive filler material, and
• between 10% and 30% first encapsulant resin,
• wherein said thermally conductive filler material is fully wetted out and encapsulated by said first encapsulant resin;
• and
• a second resin, wherein said thermally conductive initial mixture is uniformly dispersed throughout said second resin.

A method of forming a thermally conductive composition comprising the steps of:

• providing a thermally conductive filler material;
• mixing said thermally conductive filler material into a first encapsulant resin, wherein said thermally conductive filler material is fully wetted out and encapsulated by said first encapsulant resin to form a thermally conductive initial mixture;
• and
• mixing said thermally conductive concentrate into a second resin to form a thermally conductive molding composition.