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US 2006/0135653 A1Published application
Electronic molding composition and method
AssigneeGeneral Electric Company
InventorsKenneth Zarnoch, Prameela Susarla, Michael Vallance
Life of this patent
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Abstract
A curable molding composition is provided having a binder system and a filler system. The molding composition is useful as an electronic material composition for electronic devices.
Claims37
A composition comprising:
- (a) a curable binder, said binder comprising at least one functionalized poly(arylene ether) and at least one olefinically unsaturated monomer;
- and
- (b) a filler, said filler comprising a coating of hydrolyzed, condensed poly (silane).
An electronic device comprising:
- (a) a substrate;
- and
- (b) an electronic material composition adjacent to said substrate, said electronic material composition comprising a curable binder, said binder comprising at least one functionalized poly(arylene ether) and at least one olefinically unsaturated monomer, and a filler wherein the filler comprises a coating of hydrolyzed, condensed poly (silane).
A method of making an electronic material composition, said method comprising:
- (a) providing a curable binder, said binder comprising at least one functionalized poly(arylene ether) and at least one olefinically unsaturated monomer;
- (b) providing a filler comprising a coating of hydrolyzed, condensed poly (silane);
- and
- (c) mixing said binder and filler to form a blend.
1 more element
Dependencies are inferred from the claim text.