Microbicidal compositions and their use

A process for protecting an industrial material from fungal infestation or fungal growth comprising contacting the industrial material with an effective amount of a water-based composition comprising a potassium salt of N′-hydroxy-N-cyclohexyldiazenium oxide (KHDO) and water, wherein the water-based composition has a pH of at least 4, and thereby killing any fungus on or in the industrial material.

The process of claim 1, wherein the KHDO is the sole fungicidally active component of the water-based composition.

The process of claim 1, wherein the water-based composition further comprises a second fungicidally active component selected from the group consisting of 2-bromo-2-nitropropane-1,3-diol (BNPD);

• 1,2-benzisothiazol-3 (2H)-one (BIT);
• a polyvinylamine consisting of 95% vinylamine and 5% vinylformamide units by weight (PVA);
• and benzalkonium chloride (BACI).

A process for protecting an industrial material from microbial infestation comprising contacting the industrial material with an effective amount of a water-based composition comprising (A) a potassium salt of N′-hydroxy-N-cyclohexyldiazenium oxide (KHDO) and (B) a second microbicidally active component selected from the group consisting of 2-bromo-2-nitropropane-1,3-diol (BNPD);

• 1,2-benzisothiazol-3 (2H)-one (BIT);
• a polyvinylamine consisting of 95% vinylamine and 5% vinylformamide units by weight (PVA);
• and benzalkonium chloride (BACI), wherein the water-based composition has a pH of at least 4.

A water-based microbicidal composition for preventing microbial infestation of an industrial material from microorganisms, which composition comprises (A) a potassium salt of N′-hydroxy-N-cyclohexyldiazenium oxide (KHDO) and (B) a second microbicidally active component selected from the group consisting of 2-bromo-2-nitropropane-1,3-diol (BNPD);

• 1,2-benzisothiazol-3 (2H)-one (BIT);
• a polyvinylamine consisting of 95% vinylamine and 5% vinylformamide units by weight (PVA), and benzalkonium chloride (BACI), wherein the composition has a pH of at least 4.