Semiconductor manufacturing apparatus, liquid container, and semiconductor device manufacturing method

A semiconductor manufacturing apparatus comprising:

• a discharge portion discharging a coating liquid onto a substrate;
• a gas supply tube supplying an inert gas into a liquid container that contains the coating liquid, and pressurizing an interior of the liquid container;
• a coating liquid supply tube airtightly supplying the coating liquid from the liquid container to the discharge portion using pressurization from the gas supply tube;
• a first connecting portion capable of attaching and detaching the liquid container to and from the coating liquid supply tube;
• a second connecting portion capable of attaching and detaching the liquid container to and from the gas supply tube;
• and
• a liquid bath including the solvent capable of dissolving the coating liquid,
• wherein the first connecting portion and the second connecting portion are present in the liquid bath.

A semiconductor manufacturing method using a semiconductor manufacturing apparatus comprising a discharge portion discharging a coating liquid onto a substrate;

• a gas supply tube pressurizing an interior of the liquid container with an inert gas;
• a coating liquid supply tube airtightly supplying the coating liquid from the liquid container to the discharge portion using pressurization from the gas supply tube;
• a first connecting portion capable of attaching and detaching the liquid container to and from the coating liquid supply tube;
• a second connecting portion capable of attaching and detaching the liquid container to and from the gas supply tube;
• and an exhaust tube capable of reducing an internal pressure of the coating liquid supply tube including the first connecting portion:
• the method comprising:
• attaching the liquid container to the first connecting portion and the second connecting portion;
• supplying the inert gas to the liquid container via the gas supply tube, thereby carrying the coating liquid to the discharge portion via the coating liquid supply tube;
• discharging the coating liquid to the substrate from the discharge portion;
• reducing an internal pressure of the liquid container via the exhaust tube and the second connecting portion after discharging the coating liquid;
• and
• returning the coating liquid in the first connecting portion and the liquid supply tube to the liquid container by using the pressure in the liquid container.