Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device

A manufacturing method of a semiconductor device comprising a conductive layer, comprising:

• forming an organic resin layer over a substrate;
• forming an inorganic insulating layer partially covering the organic resin layer;
• forming a low wettability layer with respect to a composition containing a conductive particle over the inorganic insulating layer;
• coating the organic resin layer with the composition containing a conductive particle and baking the composition containing a conductive particle.

A method of a semiconductor device comprising a conductive layer, comprising:

• forming a semiconductor element over a substrate;
• forming an inorganic insulating layer over the semiconductor element and exposing a part of a conductive layer connected to one of a source region and a drain region of the semiconductor element;
• forming an organic resin layer partially overlapping the inorganic insulating layer and the exposed conductive layer;
• forming a low wettability layer with respect to a composition containing a conductive particle over a portion of the inorganic insulating layer, wherein the portion is not covered by the organic resin layer;
• removing the organic resin layer;
• and
• coating the inorganic insulating layer with the composition containing a conductive particle;
• baking the composition containing a conductive particle.

A manufacturing method of a semiconductor device comprising a conductive layer, comprising:

• forming a semiconductor element over a substrate;
• forming a photosensitive resin layer over the semiconductor element;
• forming an inorganic insulating layer partially overlapping the photosensitive resin layer;
• forming a low wettability layer with respect to a composition containing a conductive particle over the inorganic insulating layer;
• exposing a part of the photosensitive resin layer to light and developing for exposing a part of a conductive layer connected to one of a source region and a drain region of the semiconductor element;
• coating the photosensitive resin layer with the composition containing a conductive particle;
• and
• baking the composition containing a conductive particle.