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US 2006/0134914 A1Published application
Flexible circuits and method of making same
Assignee3M Innovative Properties Company
InventorsSridhar Dasaratha, James McHattie, James Shirck, Hideo Yamazaki, Yuji Hiroshige, Makoto Sekiguchi
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Abstract
Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method.
Claims29
A method comprising:
- providing a dielectric substrate having a first metal layer that is permeable to a dielectric etchant capable of etching the dielectric substrate;
- and
- exposing at least a portion of the first metal layer to the dielectric etchant such that the portion of the dielectric layer under the exposed portion of the first metal layer is etched,
- wherein the dielectric etchant comprises an oxidizing agent and a base that comprises at least one of (1) about 20 to about 100 grams/liter of sodium hydroxide and (2) about 60 to about 100 grams/liter of potassium hydroxide.
1 more element
A method comprising:
- providing a dielectric substrate having a first metal layer that is permeable to a dielectric etchant capable of etching the dielectric substrate;
- and
- exposing at least a portion of the first metal layer to the dielectric etchant such that the portion of the dielectric layer under the exposed portion of the first metal layer is etched,
- wherein the dielectric etchant comprises sodium permanganate and at least one base.
1 more element
A method comprising:
- providing a dielectric substrate having at least a first metal layer;
- exposing at least a portion of the first metal layer to an etchant capable of etching the first metal layer for a time sufficient to cause the first metal layer to be thinned enough to be permeable to a dielectric etchant capable of etching the dielectric substrate;
- and
- exposing at least a portion of the first metal layer to the dielectric etchant such that the dielectric substrate under the exposed portion of the first metal layer is etched.
1 more element
An article comprising:
- a dielectric substrate having a treated surface,
- a patterned first metal layer leaving a portion of the treated surface of the dielectric substrate exposed, and
- a second metal layer covering the patterned first metal layer,
- wherein at least a portion of the exposed portion of the treated surface of the dielectric substrate has been removed.
1 more element
Dependencies are inferred from the claim text.