Process for substrate incorporating component

A process for producing a component-embedded substrate, comprising the steps of:

• connecting and fixing a first electronic component to a first electrode pattern on a first supporting layer with a conductive bonding material;
• press-bonding a second supporting layer including a second electrode pattern onto the electronic component-fixed surface of the first supporting layer with a first prepreg therebetween to perform transfer;
• separating the first supporting layer and the second supporting layer from the first prepreg such that the first and second electrode patterns are disposed on a front surface and a back surface of the first prepreg;
• curing the first prepreg before or after the step of separating the first supporting layer and the second supporting layer from the first prepreg;
• connecting and fixing a second electronic component onto a back surface of the second electrode pattern with a conductive bonding material;
• press-bonding a third supporting layer including a third electrode pattern onto a second electronic component-fixed surface with a second prepreg therebetween to perform transfer;
• separating the third supporting layer from the second prepreg;
• and
• curing the second prepreg before or after the step of separating the third supporting layer from the second prepreg, wherein the prepregs and the electrode patterns are sequentially laminated.

A process for producing a component-embedded substrate, comprising the steps of:

• connecting and fixing a first electronic component on a surface of an electrode pattern on a supporting layer with a conductive bonding material;
• press-bonding a first prepreg onto the first electronic component-fixed surface of the supporting layer;
• separating the supporting layer from the first prepreg;
• curing the first prepreg before or after the step of separating the supporting layer from the first prepreg;
• connecting and fixing a second electronic component onto a back surface of the electrode pattern with a conductive bonding material;
• press-bonding a second prepreg onto the second electronic component-fixed surface;
• and
• curing the second prepreg.

A process for producing a component-embedded substrate, comprising the steps of:

• connecting and fixing a first electronic component onto the surface of a first electrode pattern on a first supporting layer with a conductive bonding material;
• press-bonding a second supporting layer including a second electrode pattern onto the electronic component-fixed surface of the first supporting layer with a first prepreg therebetween to perform transfer;
• separating the first supporting layer and the second supporting layer from the first prepreg such that the first and second electrode patterns are disposed on a front surface and a back surface of the first prepreg;
• curing the first prepreg before or after the step of separating the first supporting layer and the second supporting layer from the first prepreg;
• connecting and fixing a second electronic component onto the back surface of the first electrode pattern with a conductive bonding material;
• press-bonding a third supporting layer including a third electrode pattern onto a second electronic component-fixed surface with a second prepreg therebetween to perform transfer;
• separating the third supporting layer from the second prepreg;
• and
• curing the second prepreg before or after the step of separating the third supporting layer from the second prepreg, wherein the prepregs and the electrode patterns are sequentially laminated through the steps.