Connection ball positioning method and device for integrated circuits
AssigneeSTMicroelectronics S.r.l.
InventorsMohamed Boufnichel, Patrick Hougron, Vincent Jarry
Life of this patent
Estimating the term…
Abstract
Forming conductive bumps on an integrated circuit wafer by sucking in conductive balls into cavities of a mask, placing the mask supporting the balls on the integrated circuit wafer, temporarily attaching the mask and the wafer together, cutting the suction, and submitting the mask and wafer assembly to a thermal ball melting processing.
Claims26
A mask for positioning conductive balls on an integrated circuit wafer, comprising, in a first surface, cavities for individually receiving the balls, each cavity communicating with a second surface of the mask by a channel with a cross-section smaller than the cavity cross-section and being able to contain with clearance a whole ball.
An element-placing member, comprising:
- first and second surfaces;
- cavities formed in the first surface and each operable to receive a respective element to be placed, the element having a width;
- and
- channels formed in the second surface and each operable to couple a suction to a respective one of the cavities and having a respective width that is smaller than the width of the element.
A wafer-processing system, comprising:
- a member having first and second surfaces,
- cavities formed in the first surface of the member and each operable to receive a respective element to be placed, the element having a width, and
- channels formed in the second surface of the member and each operable to couple a suction to a respective one of the cavities and having a respective width that is smaller than the width of the element.
A method, comprising:
- sucking elements into respective cavities of a placement member;
- positioning the member over a predetermined portion of a receiving member;
- and
- releasing the elements onto the receiving member.
Dependencies are inferred from the claim text.