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US 2006/0134901 A1Published application
Hot-Melt Underfill Composition and Methos of Application
AssigneeNational Starch and Chemical Investment Holding Corporation
InventorsRaghunandan Chaware, Xiping He, David Shenfield
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Abstract
This invention provides a process for applying a wafer level underfill comprising: providing a solvent-free hot-melt underfill composition; melting the underfill; applying the underfill in a uniform layer to the active side of a semiconductor wafer; returning the underfill to a solid state; optionally B-staging the underfill; optionally removing any excess underfill from the bumps on the wafer; and dicing the wafer into individual dies.
Claims8
A process for applying a wafer-level underfill comprising:
- (i.) providing a solvent-free hot-melt underfill composition
- (ii.) melting the underfill,
- (iii.) applying the underfill in a uniform layer to the active side of a semiconductor wafer,
- (iv.) returning the underfill to a solid state,
- (v.) dicing the wafer into individual dies.
2 more elements
Dependencies are inferred from the claim text.