Method for Cutting Printed Circuit Board
AssigneeNan Ya Printed Circuit Board Corporation
InventorsTung-Zung Wu, Kuo-Feng Yang, Chun-Chieh Huang
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Abstract
A method for cutting a printed circuit board includes providing a printed circuit board including a cutting region having a plurality of metal conducting wires, disposing a patterned first protection layer on the printed circuit board surface and exposing the metal conducting wires in the cutting region, forming a conducting layer on a surface of the metal conducting wires, disposing a second protection layer on the cutting region, performing a cutting process in the cutting region, and removing the second protection layer.
Claims20
A method for cutting a printed circuit board, the method comprising:
- providing a printed circuit board, wherein a surface of the printed circuit board comprises at least a cutting region;
- disposing a protection layer on the cutting region;
- and
- performing a cutting process in the cutting region.
A method for cutting a printed circuit board, the method comprising:
- providing a printed circuit board, wherein a surface of the printed circuit board comprises at least a cutting region comprising a plurality of metal conducting wires disposed on the surface of the printed circuit board;
- disposing a patterned first protection layer on the printed circuit board and exposing the metal conducting wires in the cutting region;
- disposing a second protection layer on the cutting region;
- performing a cutting process in the cutting region;
- and
- removing the second protection layer.
Dependencies are inferred from the claim text.