Wafer structure, chip structure, and fabricating process thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJian Lo, Mon Tsai, Tsung Wu
Life of this patent
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Abstract
A chip fabricating process with the following steps is provided. Firstly, an under ball metal (UBM) layer is formed on a plurality of bump pads and wire pads of a wafer. Then, a portion of the thickness of the UBM layer on the wire pads is removed so as to form a metal lining on the wire pads. Then, a bump is formed on the UBM layer of each bump pad. At last, the wafer is cut into a plurality of chip structures, and each chip structure includes a portion of the bump pads and the wire pads. Therefore, the present invention can fabricate the chip structure with two kinds of pads. Moreover, the present invention also discloses a chip structure and a wafer structure.
Claims16
A method for manufacturing chips, comprising the steps of:
- providing a wafer provided with a plurality of bump pads and a plurality of wire pads thereon;
- forming an under ball metal (UBM) layer on the bump pads and wire pads;
- removing a portion of the thickness of the UBM layer on the wire pads so as to form a metal lining on the wire pads;
- forming a bump on the UBM layer on each of the bump pads;
- and
- cutting the wafer into a plurality of chip structures.
A method for manufacturing chips, comprising the steps of:
- providing a wafer provided with a plurality of bump pads and a plurality of wire pads thereon;
- forming a covering layer on the bump pads of the wafer;
- forming a UBM material layer on the wafer;
- removing the covering layer and a portion of the UBM material layer so as to form a UBM layer on the bump pads and expose the wire pads;
- forming a bump on the UBM layer on each of the bump pads;
- and
- cutting the wafer into a plurality of chip structures.
Dependencies are inferred from the claim text.