Method for fabricating capacitor of semiconductor device
AssigneeHynix Semiconductor Inc.
InventorsHyung Choi, Jong Park, Kee Lee, Jong Lee
Life of this patent
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AssigneeHynix Semiconductor Inc.
InventorsHyung Choi, Jong Park, Kee Lee, Jong Lee
Estimating the term…
A method for forming a capacitor of a semiconductor device includes forming a first insulation layer having a storage node plug on a semiconductor substrate; forming an etch stop layer and a second insulation layer sequentially on the substrate having the first insulation layer; forming a hole exposing a portion of the storage node plug by selectively etching the second insulation layer by using the etch stop layer; recessing a portion of the storage node plug exposed by the hole; forming a barrier metal layer on a surface of the recessed storage node plug; forming a storage node electrode connected to the storage node plug through the barrier metal layer in the hole; and forming a dielectric layer and a metal layer for a plate electrode sequentially on the storage node electrode.
A method for fabricating a capacitor of a semiconductor device, which comprises the steps of:
Dependencies are inferred from the claim text.