Interconnect and head gimbal assembly with the same
AssigneeSamsung Electronics Co., Ltd.
InventorEun-kyu Jang
Life of this patent
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Abstract
An interconnect for connecting a magnetic head slider and a flexible printed circuit, and a head gimbal assembly having the interconnect are provided. The interconnect includes a ground layer, a first insulation layer formed on the ground layer, and a pair of signal transferring layers formed on the first insulation layer and spaced apart from each other, in which the ground layer has an outer ground layer portion formed at an outside of the pair of signal transferring layers and not superposed on the pair of signal transferring layers, and an inner ground layer portion formed between the pair of the signal transferring layers.
Claims17
An interconnect connected to a magnetic head slider of a hard disk drive for transferring a signal, comprising:
- a ground layer;
- a first insulation layer formed on the ground layer;
- and
- a pair of signal transferring layers formed on the first insulation layer and spaced apart from each other,
- wherein the ground layer has an outer ground layer portion formed at an outside of the pair of signal transferring layers and an inner ground layer portion formed between the pair of the signal transferring layers.
A head gimbal assembly including a suspension, a magnetic head slider attached to and supported by the suspension, and an interconnect connected to the magnetic head slider transferring a signal, the interconnect comprising:
- a ground layer;
- a first insulation layer formed on the ground layer;
- and
- a pair of signal transferring layers formed on the first insulation layer and spaced apart from each other,
- wherein the ground layer has an outer ground layer portion formed at an outside of the pair of signal transferring layers and an inner ground layer portion formed between the pair of the signal transferring layers.
Dependencies are inferred from the claim text.