Method of forming a semiconductor laser chip having a marker
AssigneeOki Electric Industry Co., Ltd.
InventorMitsumasa Muraishi
Life of this patent
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Abstract
A method of manufacturing a semiconductor laser chip has following steps. First, a semiconductor substrate including an active layer and a block layer is provided. An electrode line pattern and a marker are formed on the semiconductor substrate. The semiconductor substrate is etched to form a W channel. Then, an oxide layer is formed on the semiconductor substrate to cover the electrode line pattern and the marker. A part of the oxide layer to form an electrode contact that exposes the electrode line pattern. A mounting electrode is formed on the electrode line pattern. Finally, the semiconductor substrate is divided into a plurality of semiconductor laser chip.
Claims9
1-7. (canceled)
A method of manufacturing a semiconductor laser chip comprising:
- providing a semiconductor substrate including an active layer and a block layer;
- forming an electrode line pattern on the semiconductor substrate;
- etching the semiconductor substrate to form a W channel;
- forming an oxide layer on the semiconductor substrate;
- removing a part of the oxide layer to form an electrode contact that exposes the electrode line pattern and a marker that exposes the semiconductor substrate;
- forming a mounting electrode on the electrode line pattern;
- and
- dividing the semiconductor substrate into a plurality of semiconductor laser chip.
15-20. (canceled)
Dependencies are inferred from the claim text.