Method of marking a low profile packaged semiconductor device
AssigneeSemiconductor Components Industries, LLC
InventorsJames Knapp, Jay Yoder, Harold Anderson
Life of this patent
Estimating the term…
Abstract
A semiconductor device (10) is made by mounting the bottom surfaces (31, 44, 54) of a semiconductor die (14) and a lead (15, 17) on a tape (12) and over a hole (19) in the tape. A vacuum is drawn through the hole to secure the die in place when the lead's top surface (43) is wirebonded to a top surface (32) of the semiconductor die. A molding material (49) is formed to encapsulate the top surface of the semiconductor die and to expose its bottom surface.
Claims20
A method of making a semiconductor device, comprising:
- mounting a semiconductor die on a tape and over a hole in the tape;
- drawing a vacuum through the hole to secure the semiconductor die;
- and
- attaching a wirebond to a first surface of the semiconductor die while drawing the vacuum.
A method of making a semiconductor device, comprising:
- mounting a semiconductor die over a hole in a tape;
- and
- drawing a vacuum through the hole while wirebonding the semiconductor die.
A method of packaging a semiconductor die, comprising drawing a vacuum through a hole in a tape to maintain a position of a semiconductor die while wirebonding the semiconductor die to a lead.
Dependencies are inferred from the claim text.