Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and SAW device

A method of manufacturing an integrated circuit device, said method comprising:

• preparing an integrated circuit element which has an element substrate, a predetermined conductive pattern and a projecting electrode formed on said element substrate;
• preparing a packaging substrate which has an external connecting terminal having a predetermined height and is electrically connected with a mounting substrate, and a supporting layer which has a thickness not smaller than said predetermined height of said external connecting terminal;
• said supporting layer being formed at least in an area corresponding to a position where said integrated circuit element is mounted;
• bringing said supporting layer into contact with said stage upon setting said packaging substrate on said stage with said element mounting surface being directed to the outside;
• and
• joining said integrated circuit element to said element mounting surface of said packaging substrate by applying ultrasonic wave vibration while pushing said integrated circuit element towards said supporting layer.

A method of manufacturing an integrated circuit device, said method comprising:

• preparing an integrated circuit element which has an element substrate, a predetermined conductive pattern and a projecting electrode formed on said element substrate;
• preparing a packaging substrate which has an external connecting terminal electrically connected with a mounting substrate and formed on a terminal forming surface positioned at a side opposite to said element mounting surface;
• preparing a stage having a supporting projection capable of being contact with at least an area corresponding to a position where said integrated circuit element is mounted except said external connecting terminal forming area on said terminal forming area;
• setting said packaging substrate on said supporting projection of said stage with said element mounting surface being directed to the outside;
• and
• joining said integrated circuit element to said element mounting surface of said packaging substrate by applying ultrasonic wave vibration while pushing said integrated circuit element towards said supporting projection.