Packaged semiconductor die and manufacturing method thereof

A packaged semiconductor die comprising:

• a die substrate that includes an insulating substrate and a circuit pattern formed on the insulating substrate;
• a semiconductor package that is a known good package, the semiconductor package coupled to the die substrate, the semiconductor package including a semiconductor chip electrically coupled to the circuit pattern;
• and
• a sealant sealing the semiconductor package.

A product, comprising:

• chip means, the chip means including:
• a die substrate that includes an insulating substrate and a circuit pattern formed on the insulating substrate;
• a semiconductor package that is a known good package, the semiconductor package coupled to the die substrate, the semiconductor package including a semiconductor chip electrically coupled to the circuit pattern;
• and
• a sealant sealing the semiconductor package;
• means for providing power to the circuit pattern of the chip;
• and
• means for applying chip functionality for the product.