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US 2006/0134832 A1Published application
Manufacturing method of semiconductor device
AssigneeRenesas Technology Corp.
InventorsToshihiro Iwasaki, Michitaka Kimura, Kozo Harada
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Abstract
The manufacturing method of the semiconductor device of the present invention has a step forming solder balls on the circuit face of a mother chip, a step making flip chip bonding of the daughter chip after the step forming solder balls on the circuit face of the mother chip, and a step making flip chip bonding of the mother chip on a circuit board using the solder balls.
Claims7
A manufacturing method of a semiconductor device, comprising the steps of:
- forming solder balls on a circuit face of a mother chip;
- making flip chip bonding of a daughter chip on the circuit face of the mother chip after the step forming solder balls;
- and
- making flip chip bonding of the mother chip on a circuit board using the solder balls.
1 more element
Dependencies are inferred from the claim text.