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US 2006/0134830 A1Published application
Method and system for performing die attach using a flame
AssigneeIntel Corporation
InventorsKris Frutschy, Sudarshan Rangaraj, Tom Lappin
Life of this patent
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Abstract
Embodiments of a method for attaching a die to a substrate using a flame or other heat source are disclosed. The flame may be produced by combustible gas. Also disclosed are embodiments of a system for performing die attach using a flame. Other embodiments are described and claimed.
Claims28
A method comprising applying a flame to one side of a die to reflow a number of solder leads extending between an opposing side of the die and a substrate.
A method comprising:
- placing a die on a substrate, the die having a front side and an opposing back side, the die having a number of leads extending from the front side, each of the leads mating with a corresponding one of a number of lands on the substrate;
- and
- applying a flame to the die back side to heat the die and bond each die lead to the corresponding one land on the substrate.
A system comprising:
- a device to hold a substrate;
- and
- a flame source to heat a die disposed on the substrate and reflow a number of leads extending between the die and substrate.
A method comprising:
- placing a die on a substrate, the die having a front side and an opposing back side, the die having a number of leads extending from the front side, each of the leads mating with a corresponding one of a number of lands on the substrate;
- and
- applying a heat source to the die back side to heat the die and bond each die lead to the corresponding one land on the substrate, the heat source selected from a group consisting of superheated air, plasma, and steam.
Dependencies are inferred from the claim text.