Package that integrates passive and active devices with or without a lead frame
AssigneeTexas Instruments Incorporated
InventorSteven Kummerl
Life of this patent
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Abstract
According to an embodiment of the invention, a component package comprises a plurality of components and mold compound. The plurality of components are disposed on a zero plane of a removable substrate. The removal substrate is operable to hold the plurality of components in position. At least one of the plurality of components is wire bonded to at least another of the plurality of components with a wire bond. The mold compound is disposed around the plurality of components, encapsulating the plurality of components. A portion of the plurality of the components disposed upon the zero plane of the removable substrate are exposed upon removal of the substrate from the component package.
Claims20
A method of providing a component package, the method comprising:
- disposing a plurality of components on a zero plane of a removable substrate, the plurality of components comprising at least an integrated circuit and at least one passive component;
- wire bonding, via a wire bond, the integrated circuit to the at least one passive component;
- injection molding a mold compound around the plurality of components to form the component package, the removable substrate holding the plurality of components in position during the injection molding and the mold compound encapsulating the plurality of components;
- removing the removable substrate;
- exposing a portion of the integrated circuit disposed on the removal substrate;
- and
- exposing a portion of the at least one passive component disposed on the removal substrate.
A component package comprising:
- a plurality of components disposed on a zero plane of a removable substrate, the removal substrate operable to hold the plurality of components in position and at least one of the plurality of components wire bonded to at least another of the plurality of components with a wire bond;
- a mold compound disposed around the plurality of components, the mold compound encapsulating the plurality of components;
- and
- wherein a portion of the plurality of the components disposed upon the zero plane of the removable substrate are exposed upon removal of the substrate from the component package.
A method of providing a component package, the method comprising:
- disposing a plurality of components on a zero plane of a removable substrate;
- wire bonding at least one of the components to at least another of the components;
- disposing a mold compound on the plurality of components, the removable substrate holding the components in position during the disposing of the mold compound;
- removing the removable substrate;
- and
- exposing a portion of the plurality of the components disposed upon the zero plane of the removable substrate.
Dependencies are inferred from the claim text.