Injection-molded package for MEMS inertial sensor

A method of packaging a device, comprising the steps of:

• providing a substrate having an device provided therein or thereon;
• providing a cap having a number openings;
• attaching the cap to the substrate and sealing the device within an interior cavity at least partially formed by the cap and substrate;
• inserting the capped substrate into a vacuum chamber and drawing gasses and/or contaminants contained within the interior cavity out through the openings to form a controlled vacuum pressure within the interior cavity;
• and
• injection molding a package about the capped substrate.

A method of packaging a device, comprising the steps of:

• providing a substrate having an device provided therein or thereon;
• attaching a cap to the substrate and sealing the device within an interior cavity at least partially formed by the cap and substrate;
• providing a lead frame including one or more conductive leads;
• attaching the capped substrate to the lead frame and electrically connecting the device to the one or more conductive leads of the lead frame;
• inserting the capped substrate and lead frame into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity to form a reduced pressure or vacuum-filled reference cavity therein;
• and
• injection molding a package about the capped substrate and at least a portion of the lead frame while under a reduced or vacuum pressure within said vacuum chamber.

A method of packaging a device, comprising the steps of:

• providing a substrate having an device provided therein or thereon;
• providing a cap having a number openings therethrough;
• attaching the cap to the substrate and sealing the inertial sensor within an interior cavity that is at least partially formed by cap and substrate;
• inserting the capped substrate into a vacuum chamber and drawing gasses and/or contaminants contained within the interior cavity out through the openings to form a controlled vacuum pressure therein;
• injecting an inert gas into the interior cavity through the openings to form a partial pressure therein;
• and
• injection molding a package about the capped substrate.

A method of packaging a device, comprising the steps of:

• providing a substrate having a device provided therein or thereon;
• attaching a cap to the substrate and sealing the device within an interior cavity at least partially formed by the capped substrate;
• inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity to form a reduced pressure or vacuum-filled reference cavity therein;
• and
• injection molding a metal or ceramic package about the capped substrate while under a reduced or vacuum pressure within said vacuum chamber.

A method of packaging a MEMS device, comprising the steps of:

• providing a substrate having an inertial sensor provided therein or thereon;
• attaching a cap to the substrate and sealing the inertial sensor within an interior cavity at least partially formed by the cap and substrate;
• inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity to form a reduced pressure or vacuum-filled reference cavity therein;
• and
• injection molding a package about the capped substrate while under a reduced or vacuum pressure within the vacuum chamber.