Adhesive sheet and layered product
OwnerTakashi Yoshitomi, Kazunori Kojima +3inventors
InventorsTakashi Yoshitomi, Kazunori Kojima, Tsutomu Nakamura, Toyoaki Ishiwata, Toru Sawaki
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Abstract
There are provided an adhesive sheet, exhibiting a specific peel strength and shear peel strength and being composed of a base material (A) comprising a fully aromatic polyimide film having a glass transition temperature of 200° C. or above and a thermal adhesive layer (C) comprising a fully aromatic polyamide having a glass transition temperature of 200-500° C., as well as a laminate composed of the sheet and a process for its production. Also provided is a method of release after treatment of the laminate composed of the adhesive sheet, to obtain a laminate having the target to-be-treated layer.
Claims36
An adhesive sheet composed of a base material (A) comprising a fully aromatic polyimide film having a glass transition temperature of 200° C. or above and a thermal adhesive layer (C) comprising a fully aromatic polyamide having a glass transition temperature of 200-500° C., the adhesive sheet being characterized in that, when the thermal adhesive layer (C) and base material (A) are laminated in that order on a silicon wafer adherend, either or both of the following conditions (a) and (b) are satisfied.
- (a) A peel strength of 0.1-300 N/m at the interface between the thermal adhesive layer (C) and silicon wafer upon thermocompression bonding for 15 minutes at 300° C., 5.0-6.0 MPa.
- (b) A shear peel adhesive strength of 1-1000 N/cm2 at the interface between the thermal adhesive layer (C) and silicon wafer upon thermocompression bonding for 2 minutes at 300° C., 5.0-6.0 MPa.
A laminate (I′) which is composed of a base material (A) comprising a fully aromatic polyimide film with a glass transition temperature of 200° C. or above and an inorganic material (B), characterized in that when the base material (A) and a silicon wafer adherend are laminated, the base material (A) exhibits the following property:
- (a′) A peel strength of 0.1-100 N/m at the interface between the base material (A) and silicon wafer upon thermocompression bonding for 15 minutes at 370° C., 5.0-6.0 MPa.
A process for production of a laminate (IV) characterized in that, after laminating and thermocompression bonding a to-be-treated layer (D), an organic protective layer (E), a base material (A) comprising a fully aromatic polyimide film having a glass transition temperature of 200° C. or above and an inorganic material (B) in that order, the exposed surface of layer D is subjected to thinning treatment to produce layer D′ and obtain a laminate (III) composed of layer D′, layer E, layer A and layer B, after which the interface between layer E and layer A is released to obtain a laminate (IV) composed of layer D′ and layer E.
Dependencies are inferred from the claim text.