Pressure sensitive adhesive sheet, method of protecting semiconductor wafer surface and method of processing work

Abstract

Provided is a pressure sensitive adhesive sheet that does not adhere to other apparatuses, even when it is used in a manufacturing scheme using heat treatment or treatment involving heat generation. More particularly, the pressure sensitive adhesive sheet is suited for semiconductor wafer processing, possessing unprecedented high-temperature heat resistance. The pressure sensitive adhesive sheet can be used as a surface protective sheet, a dicing sheet or a pickup sheet, by imparting properties such as a protective function of an uneven circuit surface or expanding properties. The pressure sensitive adhesive sheet comprises a base material obtained by film-forming and curing a first curable resin, a top coat layer formed on the base material by coating and curing a second curable resin, and a pressure sensitive adhesive layer formed on the opposite side of the base material.

Dependencies are inferred from the claim text.