Large area transducer array

A method for fabricating a tiled transducer array, the method comprising:

• fabricating a wafer comprising a plurality of transducers;
• dicing the wafer to form individual transducers;
• testing the individual transducers to identify a plurality of known good transducers;
• preparing a substrate having a front side and a backside, wherein the backside of the substrate comprises a plurality of connectors;
• positioning the plurality of known good transducers on the front side of the substrate and aligning the plurality of transducers in a horizontal direction and a vertical direction to form a transducer array;
• and
• electrically coupling the connectors on the substrate to the plurality of known good transducers.

A stacked three-dimensional transducer array comprising:

• an electronic device disposed in a first layer and coupled to a plurality of transducers, wherein the electronic device is configured for processing a plurality of input signals;
• a substrate having a front side and a backside disposed in a second layer;
• an electrical interconnect layer disposed on the backside of the substrate;
• and
• a plurality of transducers disposed in a third layer on the front side of the substrate, the plurality of transducers configured for sensing a plurality of input signals.

A method for fabricating a stacked three-dimensional transducer array, the method comprising:

• fabricating an electrical interconnect on a substrate having a front side and a backside;
• disposing a plurality of transducers on the front side of the substrate;
• and
• coupling the plurality of transducers on the front side of the substrate to an associated electronic device.

A method of aligning a plurality of electronic devices with a plurality of transducers in a transducer array formed in an X-Y plane, the method comprising:

• positioning each of a plurality of electronic devices in a pre-determined direction;
• aligning the each of the plurality of transducers with a corresponding one of the plurality of electronic devices via a pre-fabricated spacer;
• and
• coupling each of the plurality of electronic devices to the corresponding transducer of the transducer array via an interconnect.