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US 2006/0133124 A1Published application
Semiconductor package with a controlled impedance bus and method of forming same
AssigneeRambus Inc.
InventorsNader Gamini, Donald Perino
Life of this patent
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Abstract
An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.
Claims1
A semiconductor system comprising:
- a plurality of contiguous semiconductor devices formed from a semiconductor substrate, where each of said semiconductor devices is separated from an adjacent semiconductor device by a scribe lane;
- a bus;
- and
- a plurality of electrical connections, each electrically coupling a different one of said plurality of contiguous semiconductor devices to said bus.
1 more element
Dependencies are inferred from the claim text.