Memory module and connection interface between the memory module and circuit board
AssigneeSamsung Electronics Co., Ltd.
InventorSoon-Yong Hur
Life of this patent
Estimating the term…
Abstract
A motherboard may have contact pads arranged along a peripheral region on one or both surfaces thereof. A memory module may have unit packages fixed to an upper plate and a lower plate of a module frame. The unit packages may be spaced apart from each other. The upper and the lower unit packages may have contact terminals facing each other. The contact terminals may be elastically bendable, and/or the unit packages may be mounted on the plates via elastic members. The peripheral region of the motherboard may be inserted into the memory module, so the contact terminals of the memory module may elastically contact with and be electrically coupled to the contact pads of the motherboard.
Claims38
A memory module comprising:
- a module frame having an inner space;
- and
- a unit package mounted on the module frame and located in the inner space, thus defining a receiving space in the inner space, the unit package having a plurality of contact terminals with distal ends in the receiving space.
A memory module comprising:
- a module frame having an upper part, a lower part, and an inner space defined by the upper and the lower parts;
- an upper unit package mounted on the upper part and located in the inner space, the upper unit package having a plurality of first contact terminals;
- and
- a lower unit package mounted on the lower part and located in the inner space, the lower unit package having a plurality of second contact terminals,
- the upper and the lower unit packages being spaced apart from each other, defining a receiving space in the inner space, and the first and the second contact terminals having distal ends in the receiving space.
A connection interface comprising:
- a motherboard including an upper surface, a lower surface opposing the upper surface, and a plurality of first contact pads arranged along a peripheral region of the upper surface;
- and
- a memory module including
- a module frame having an upper plate facing the upper surface, a lower plate facing the lower surface, and a side plate, the upper and the lower plates being substantially parallel to and spaced apart from each other, the side plate connecting the upper and the lower plates together, the upper, the lower and the side plates defining an inner space of the module frame;
- and
- an upper unit package mounted on the upper plate and located in the inner space, the upper unit package having a plurality of first contact terminals, the upper unit package and the lower plate defining a receiving space in the inner space,
- the peripheral region of the motherboard being located in the receiving space, and the first contact terminals of the memory module contacting and electrically coupled to the first contact pads of the motherboard.
A method comprising:
- providing a memory module having a unit package with a plurality of contact terminals having distal ends in a receiving space of the memory module;
- and
- inserting a circuit board into the receiving space of the memory module to electrically connect the circuit board to the plurality of contact terminals.
Dependencies are inferred from the claim text.