Power core devices and methods of making thereof
AssigneeE.I. du Pont de Nemours and Company
InventorsDavid McGregor, Daniel Amey, Sounak Banerji, William Borland, Karl Dietz, Attiganal Sreeram
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Abstract
The present invention relates to a power core comprising: at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor; and wherein said embedded SMT discrete chip capacitor is connected in parallel to said planar capacitor laminate.
Claims28
A power core comprising:
- at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor;
- and at least one planar capacitor laminate;
- wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor;
- and wherein said embedded SMT discrete chip capacitor is connected in parallel to said planar capacitor laminate.
A method for making a power core structure comprising;
- providing a planar capacitor laminate having at least one patterned side;
- providing a metal foil;
- laminating said metal foil to the patterned side of said planar capacitor laminate;
- creating lands and via pads on said metal foil;
- attaching at least one SMT discrete chip capacitor to said lands on said metal foil;
- and connecting said at least one SMT discrete chip capacitor in parallel to said planar capacitor laminate.
A method for making a power core structure comprising:
- providing a planar capacitor laminate having a first patterned side and a second patterned side;
- providing a metal foil;
- laminating said metal foil to one said patterned side of said planar capacitor laminate;
- creating lands and via pads on said metal foil;
- attaching at least one SMT discrete chip capacitor to said lands on said metal foil;
- and connecting said at least one SMT discrete chip capacitor in parallel to said planar capacitor laminate.
A device comprising a power core wherein said power core comprises:
- at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor;
- and at least one planar capacitor laminate;
- wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor;
- and wherein said embedded SMT discrete chip capacitor is connected in parallel to said planar capacitor laminate;
- and wherein said power core is interconnected to at least one signal layer.
A method for making a device comprising;
- providing a planar capacitor laminate having at least one patterned side;
- providing a metal foil;
- laminating said metal foil to the patterned side of said planar capacitor laminate;
- creating lands and via pads on said metal foil;
- attaching at least one SMT discrete chip capacitor to said lands on said metal foil;
- connecting said at least one SMT discrete chip capacitor in parallel to said planar capacitor laminate forming a power core;
- and forming at least one signal layer onto said power core.
A method for making a device comprising:
- providing a planar capacitor laminate having a first patterned side and a second patterned side;
- providing a metal foil;
- laminating said metal foil to one said patterned side of said planar capacitor laminate;
- creating lands and via pads on said metal foil;
- attaching at least one SMT discrete chip capacitor to said lands on said metal foil;
- connecting said at least one SMT discrete chip capacitor in parallel to said planar capacitor laminate forming a power core;
- and forming at least one signal layer onto said power core.
Dependencies are inferred from the claim text.