Cooling device, substrate, and electronic equipment
AssigneeFujitsu Limited
InventorsSonomasa Kobayashi, Kaigo Tanaka, Masaki Iwata
Life of this patent
Estimating the term…
Abstract
A cooling device for cooling electronic components mounted on a substrate, comprising a radiating member having a pair of mounting plates formed of a conductive sheet metal member in generally channel shape in cross section and positioned parallel with each other and a connection plate for connecting the pair of mounting plates to each other and a cooling fan mounted on one of the mounting plates of the radiating member, wherein the other of the mounting plates of the radiating member is formed so as to be mountable on the substrate in an abutting state thereof on the electronic components mounted on the substrate.
Claims11
A cooling device for cooling electronic components mounted on a substrate, comprising:
- a radiating member having a pair of mounting plates formed of a heat conductive sheet metal member in generally channel shape in cross section and positioned substantially parallel with each other and a connection plate for connecting the pair of mounting plates to each other;
- and
- a cooling fan mounted on one of the mounting plates of the radiating member,
- wherein another one of the mounting plates of the radiating member is formed in such a manner that another one of the mounting plates is mountable on the substrate while in contact with the electronic components mounted on the substrate.
A substrate on at least one surface of which electronic components are mounted, comprising:
- a radiating member having a pair of mounting plates formed of a heat conductive sheet metal member in generally channel shape in cross section and positioned substantially parallel with each other and a connection plate for connecting the pair of mounting plates to each other;
- and
- a cooling fan mounted on one of the mounting plates of the radiating member,
- wherein the pair of mounting plates are arranged in such a manner that the pair of mounting plates sandwich the substrate, and
- wherein the substrate is structured so that the other of the mounting plates of the radiating member is in contact with the electronic components, the connection plate being situated outside the region of the substrate, the cooling fan mounted on one of the mounting plates being situated on a surface different from the surface on which the electronic components are mounted.
An electronic equipment including a substrate on at least one surface of which electronic components are mounted, comprising:
- a radiating member having a pair of mounting plates formed of a heat conductive sheet metal member in generally channel shape in cross section and positioned substantially parallel with each other and a connection plate for connecting the pair of mounting plates to each other;
- and
- a cooling fan mounted on one of the mounting plates of the radiating member,
- wherein the pair of mounting plates are arranged in such a manner that the pair of mounting plates sandwich the substrate, and
- wherein the electronic equipment is structured so that the other of the mounting plates of the radiating member is in contact with the electronic components, the connection plate being situated outside the region of the substrate, the cooling fan mounted on one of the mounting plates being situated on a surface different from the surface on which the electronic components are mounted.
Dependencies are inferred from the claim text.