Leadframe and packaged light emitting diode
AssigneeSeoul Semiconductor Co., Ltd.
InventorsDo Kim, Chung Lee, Keon Lee
Life of this patent
Estimating the term…
Abstract
A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. A package body that may be formed by an injection molding after a heat sink is inserted into the leadframe.
Claims20
A leadframe for an electronic device, the leadframe comprising:
- a heat sink supporting ring for supporting a heat sink;
- an outer frame spaced apart from the heat sink supporting ring, the outer frame enclosing the heat sink supporting ring;
- at least one supporting lead connecting the heat sink supporting ring and the outer frame;
- and
- at least one separated lead extended from the outer frame toward the heat sink supporting ring, the separated lead being spaced apart from the heat sink supporting ring.
A packaged light emitting diode comprising:
- a heat sink supporting ring having an opening;
- a heat sink inserted into the opening of the heat sink supporting ring;
- at least two connecting leads, first and second connecting leads provided on first and second sides of the heat sink supporting ring, respectively, the first and second connecting leads being electrically isolated from each other;
- and
- a package body supporting the heat sink and the connecting leads, the package body having an opening over a first surface of the heat sink.
A method of fabricating a packaged light emitting diode comprising:
- providing a leadframe including a heat sink supporting ring configured to support a heat sink, an outer frame spaced apart from the heat sink supporting ring and enclosing the heat sink supporting ring, at least one supporting lead for connecting the heat sink supporting ring and the outer frame, and at least one separated lead extended from the outer frame toward the heat sink supporting ring and spaced apart from the heat sink supporting ring;
- inserting a heat sink into an opening of the heat sink supporting ring;
- forming a package body exposing first and second surfaces of the heat sink;
- and
- mounting at least one light emitting diode die on the first surface of the heat sink.
Dependencies are inferred from the claim text.