Heat spreader with multiple stacked printed circuit boards
AssigneeHewlett-Packard Development Company, L.P.
InventorsBrent Boudreaux, Shaun Harris, Eric Peterson, Christian Belady, Gary Williams, Stuart Haden
Life of this patent
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Abstract
A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
Claims30
A multiple stacked printed circuit board (PCB) module comprising:
- a first PCB;
- a second PCB connected in a stacked configuration with the first PCB;
- and
- a heat spreader comprising:
- a top section;
- and
- side sections extending from the top section to bottom edges, the side sections and top section defining an interior of the heat spreader;
- and wherein:
- the interior of the heat spreader contains the first PCB therein;
- the bottom edges of the side sections extend to the second PCB;
- and
- the heat spreader and second PCB substantially enclose the first PCB therein.
A heat spreader for use with multiple stacked printed circuit boards (PCBs) comprising:
- a top section;
- and
- side sections extending from the top section to bottom edges, the side sections and top section defining an interior of the heat spreader;
- and wherein:
- the interior substantially conforms to a first one of the PCBs to contain the first PCB substantially within the interior;
- the bottom edges of the side sections substantially conform to edges of a second one of the PCBs stacked with the first PCB;
- and
- the heat spreader and second PCB, when connected together with the first PCB, substantially enclose the first PCB therein.
A heat spreader for use with multiple stacked printed circuit boards (PCBs) comprising:
- a means for substantially covering a first one of the PCBs;
- and
- a means for substantially surrounding edges of the first PCB and a second one of the PCBs when the first and second PCBs are stacked together and connected to the heat spreader, the covering means and the surrounding means defining an interior of the heat spreader within which the first PCB is contained;
- and wherein the heat spreader and second PCB, when connected together with the first PCB, substantially enclose the first PCB therein.
A method for dissipating heat and suppressing electromagnetic interference (EMI) generated by multiple stacked printed circuit boards (PCBs) comprising:
- connecting a heat spreader to first and second ones of the stacked PCBs, the heat spreader substantially surrounding edges of the first and second PCBs and a top side of the first PCB;
- and
- upon operation of the first and second PCBs:
- transferring heat from a component of the first PCB to the heat spreader and then to ambient air;
- transferring heat from a component of the second PCB to the heat spreader and then to the ambient air;
- and
- suppressing EMI generated by the components of the first and second PCB by the heat spreader.
A multiple stacked printed circuit board (PCB) module comprising:
- three or more PCBs connected together in a stacked configuration;
- and
- a heat spreader comprising:
- a top section;
- and
- side sections extending from the top section to bottom edges, the side sections and top section defining an interior of the heat spreader;
- and wherein:
- the interior of the heat spreader contains a plurality of the PCBs therein;
- the bottom edges of the side sections extend to at least one of the PCBs;
- and
- the heat spreader and the at least one of the PCBs substantially enclose the plurality of the PCBs therein.
Dependencies are inferred from the claim text.