Electronic module for system board with pass-thru holes

A method, comprising:

• connecting a first portion of an electronic module to one side of a printed circuit board (PCB) having at least one pass-thru hole;
• connecting a second portion of the electronic module to a second, opposite side of the PCB such that a thermal dissipation device disposed between the first and second portions extends through the at least one pass-thru hole;
• and
• aligning plural heat-generating devices in the first portion with plural pass-thru holes in the PCB.

An electronic module connectable to a system board with a pass-thru hole, the electronic module, comprising:

• a circuit board having plural separate processors;
• a power board coupled, to form a vertically stacked-up configuration, to the circuit board for providing power to the circuit board;
• and
• a thermal dissipation device disposed between the circuit and power boards for dissipating heat away from the processors, wherein the electronic module extends through the pass-thru hole and connects on two opposite sides of the system board.