Multi-chip module with power system and pass-thru holes

10) A method, comprising:

• connecting a memory and plural separate processors to a first circuit board;
• stacking a second circuit board between a power system board and the first circuit board;
• extending a portion of a thermal dissipation device through pass-thru holes in both the second circuit board and the power system board;
• and
• dissipating heat away from the power system board and away from the plural separate processors with the thermal dissipation device.

17) An electronic assembly, comprising:

• a circuit board having plural separate processors;
• a power board coupled, to form a vertically stacked-up configuration, to the circuit board for providing power to the circuit board, the power board having at least one opening through the power board;
• a system board having at least one opening and disposed between the circuit board and the power board;
• and
• a thermal dissipation device disposed above the power board and having at least one extension extending through the openings in the power and system boards to be above at least one of the processors.