US 2006/0133011 A1Published application

Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof

AssigneeE.I. du Pont de Nemours and Company

InventorG. Cox

Life of this patent

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Abstract

The present invention relates to a dielectric composition comprising: paraelectric filler; and polymer wherein said paraelectric filler has a dielectric constant between 50 and 150.

Claims14

Dependent claims

A dielectric composition comprising a paraelectric filler and a polymeric material wherein said composition has a dielectric constant between 50 and 150.

Dependencies are inferred from the claim text.

Facts

Application: 11/304,779Filed 15 Dec 2005
Priority: 21 Dec 2004
Published: 22 Jun 2006
Term ends: Not estimatedThe source records don’t support an estimate.

Classification36 codes

H10W 70/69
Characterised by their insulating layers or insulating parts: insulating materials thereof
B32B 7/025
Physical, chemical or physicochemical properties: electric or magnetic properties
B32B 15/08
Comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
B32B 15/082
Of synthetic resin: comprising vinyl resins; comprising acrylic resins

Family

Application60/637,816Us provisional application · filed 21 Dec 2004
Application60/648,726Us provisional application · filed 1 Feb 2005
US 7,495,887 B2Related patent
US 2006/0133011 A1This patent

From the US filing history. Foreign family members aren’t listed.

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