Exposure system, exposure method and method for manufacturing a semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorKazuya Fukuhara
Life of this patent
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Abstract
An exposure system includes: an illumination optical system defining, in an effective illumination source plane, a center region forming a perpendicularly incident light and first and second eccentric regions forming obliquely incident lights having a perpendicular electric vector component perpendicular to a straight line connecting the first and second eccentric regions, the electric vector component being larger than a parallel electric vector component parallel to the straight line, and illuminating the mask pattern with the perpendicularly incident light and the obliquely incident lights; and a projection optical system projecting an image of the mask pattern to a processing object.
Claims20
An exposure system comprising:
- an illumination optical system configured to define, in an effective illumination source plane, a center region forming a perpendicularly incident light having an optical axis perpendicular to a plane of a mask pattern and first and second eccentric regions being opposite to each other with regard to the center region in the effective illumination source plane, each of the first and second eccentric regions forming an obliquely incident light having an optical axis oblique to the plane of the mask pattern and having a perpendicular electric vector component perpendicular to a straight line connecting the first and second eccentric regions in the effective illumination source plane, the electric vector component being larger than a parallel electric vector component parallel to the straight line, and to illuminate the mask pattern with the perpendicularly incident light and the obliquely incident lights;
- and
- a projection optical system configured to project an image of the mask pattern to a processing object with the perpendicularly incident light and the obliquely incident lights.
An exposure method comprising:
- forming, from a center region in an effective illumination source plane, a perpendicularly incident light having an optical axis perpendicular to a plane of a mask pattern;
- forming obliquely incident lights having an optical axis oblique to the plane of the mask pattern, from each of first and second eccentric regions opposite to each other with regard to the center region in the effective illumination source plane, and having a perpendicular electric vector component perpendicular to a straight line connecting the first and second eccentric regions, the perpendicular electric vector component being larger than a parallel electric vector component parallel to the straight line;
- illuminating the mask pattern with the perpendicularly incident light and the obliquely incident lights;
- and
- projecting an image of the mask pattern on a processing object.
A method for manufacturing a semiconductor device comprising:
- coating a resist film on a semiconductor wafer;
- forming, from a center region in an effective illumination source plane, a perpendicularly incident light having an optical axis perpendicular to a plane of a mask pattern;
- forming obliquely incident lights having an optical axis oblique to the plane of the mask pattern, from each of first and second eccentric regions opposite to each other with regard to the center region in the effective illumination source plane, and having a perpendicular electric vector component perpendicular to a straight line connecting the first and second eccentric regions, the perpendicular electric vector component being larger than a parallel electric vector component parallel to the straight line;
- illuminating the mask pattern with the perpendicularly incident light and the obliquely incident lights;
- projecting an image of the mask pattern to the resist film;
- developing the resist film so as to form a resist pattern;
- and
- processing the semiconductor substrate by using the resist pattern as a processing mask.
Dependencies are inferred from the claim text.