LED array package structure and method thereof

A light emitting diode array package structure used in a printer head, said structure comprising:

• a substrate with a plurality of trenches;
• at least one light emitting diode array with at least one pin located in a corresponding trench;
• at least one driver integrated circuit with at least one pin located in a corresponding trench;
• a first conductive connection structure located between said pins of said at least one light emitting diode array and said at least one driver integrated circuit for providing electrical connectivity;
• a printed circuit board with at least one input/output pin, wherein said substrate is located over said printed circuit board;
• and
• a second conductive connection structure located between said at least one driver integrated circuit and said at least one input/output pin.

A light emitting diode array packaging method, said method comprising:

• forming a plurality of trenches in a substrate;
• locating at least one light emitting diode array with at least one pin in a corresponding trench;
• locating at least one driver integrated circuit with at least one pin in a corresponding trench;
• and
• forming a first conductive connection structure between said pins of said at least one light emitting diode array and said at least one driver integrated circuit for providing electrical connectivity;
• cutting said substrate to form a plurality of individual units;
• adhering said individual units to a printed circuit board, wherein said printed circuit board has at least one input/output pin;
• and
• forming a second conductive connection structure between said at least one input/output pin and said individual units for providing electrical connectivity.