Probe card, method of manufacturing the probe card and alignment method

A method of manufacturing a probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer, the method comprising:

• attaching a thin film of a double structure to a rigid ring, the thin film having an electroconductive layer and an insulating layer superposed on each other;
• simultaneously forming, on the thin film attached to the rigid ring, a plurality of bumps and a bump for forming an alignment mark, the plurality of bumps being provided to be respectively brought into contact with all of inspection electrodes of the plurality of semiconductor integrated circuit devices on the semiconductor wafer;
• removing an unnecessary portion of the conductive layer from the thin film on which the bumps have been formed;
• and
• electrically connecting and fixing, to a wiring substrate, the thin film with bumps on which the bumps have been formed and from which the unnecessary portion of the conductive layer has been removed.