Piezoelectric device, its manufacturing method, and touch panel device
AssigneeFujitsu Limited
InventorsTakashi Katsuki, Fumihiko Nakazawa, Satoshi Sano, Yuji Takahashi
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Abstract
A piezoelectric device (X) includes a substrate (11) a piezoelectric film (12), a first electrode (13), and a second electrode (14). At least one of the first electrode (13) and the second electrode (14) is interposed between the substrate (11) and the piezoelectric film (12), and made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au.
Claims19
A piezoelectric device comprising a substrate, a piezoelectric film, a first electrode, and a second electrode;
- wherein at least one of the first electrode and the second electrode is interposed between the substrate and the piezoelectric film, and made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au.
A method of manufacturing a piezoelectric device, the method comprising:
- a step of forming a first electrode on a substrate, the electrode being made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au;
- a step of removing an oxide film on a surface of the first electrode;
- a step of forming a piezoelectric film overlapping the first electrode on the substrate;
- and
- a step of forming a second electrode on the piezoelectric film.
A method of manufacturing a piezoelectric device, the method comprising:
- a step of forming a first electrode on a substrate, the electrode being made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au on a substrate;
- a step of subjecting a surface of the first electrode to etching treatment;
- a step of forming a piezoelectric film overlapping the first electrode on the substrate;
- and
- a step of forming a second electrode on the piezoelectric film.
A method of manufacturing a piezoelectric device, the method comprising:
- a step of forming an interdigital transducer on a substrate, the transducer being made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au;
- a step of removing an oxide film on a surface of the interdigital transducer;
- and
- a step of forming a piezoelectric film overlapping the interdigital transducer on the substrate.
A method of manufacturing a piezoelectric device, the method comprising:
- a step of forming an interdigital transducer on a substrate, the transducer being made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au on a substrate;
- a step of subjecting a surface of the interdigital transducer to etching treatment;
- and
- a step of forming a piezoelectric film overlapping the interdigital transducer on the substrate.
A touch panel device comprising:
- a substrate including a detection region and a peripheral region surrounding the detection region;
- exciting means provided in the peripheral region for exciting surface acoustic waves in the substrate;
- and
- receiving means provided in the peripheral region for receiving surface acoustic waves propagated through the detection region;
- wherein at least one of the exciting means and the receiving means comprises a piezoelectric film, a first electrode, and a second electrode, wherein at least one of the first electrode and the second electrode is interposed between the substrate and the piezoelectric film, and made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au.
Dependencies are inferred from the claim text.