Surface acoustic wave device and method of manufacturing the same, IC card, and mobile electronic apparatus
AssigneeSeiko Epson Corporation
InventorsShinya Aoki, Yoshio Maeda
Life of this patent
Estimating the term…
Abstract
A surface acoustic wave device includes a surface acoustic wave (SAW) chip and a cover that are bonded in a body by bonding a metal bonding portion of the SAW chip and a metal bonding portion of the cover and bonding extraction electrodes of the SAW chip and connection electrodes of the cover so as to hermetically seal IDT electrodes disposed on a main surface of a piezoelectric substrate of the SAW chip within a space defined between the SAW chip and the cover. The IDT electrodes and external electrodes on an upper surface of an insulating substrate of the cover are electrically connected to each other through conductive materials formed in through-holes.
Claims18
A surface acoustic wave device comprising:
- a surface acoustic wave (SAW) chip having:
- IDT electrodes disposed on a main surface of a piezoelectric substrate;
- extraction electrodes extracted from the IDT electrodes;
- and
- a metal bonding portion disposed along an entire periphery of the main surface of the piezoelectric substrate;
- and
- a cover having:
- through-holes in an insulating substrate at positions corresponding to the extraction electrodes of the SAW chip;
- a metal bonding portion disposed along an entire periphery of a lower surface of the insulating substrate;
- connection electrodes disposed on the lower surface of the insulating substrate along circumferences of openings of the through-holes;
- and
- external electrodes disposed on an upper surface of the insulating substrate in peripheries of openings of the through-holes;
- wherein the SAW chip and the cover are bonded in a body by bonding the metal bonding portion of the SAW chip and the metal bonding portion of the cover and bonding the extraction electrodes of the SAW chip and the connection electrodes of the cover so as to hermetically seal the IDT electrodes within a space defined between the SAW chip and the cover, and
- wherein the IDT electrodes and the external electrodes are electrically connected to each other through conductive material in the through-holes.
A method of manufacturing a surface acoustic wave device comprising steps of:
- forming a SAW chip having:
- IDT electrodes disposed on a main surface of a piezoelectric substrate;
- extraction electrodes extracted from the IDT electrodes;
- and
- a metal bonding portion disposed along the entire periphery of the main surface of the piezoelectric substrate;
- forming a cover having:
- through-holes in an insulating substrate at positions corresponding to the extraction electrodes of the SAW chip;
- a metal bonding portion disposed along an entire periphery of a lower surface of the insulating substrate;
- and
- connection electrodes disposed on the lower surface of the insulating substrate along circumferences of openings of the through-holes;
- bonding the SAW chip and the cover in a body by bonding the metal bonding portion of the SAW chip and the metal bonding portion of the cover and bonding the extraction electrodes of the SAW chip and the connection electrodes of the cover so as to hermetically seal the IDT electrodes within a space defined between the SAW chip and the cover;
- forming external electrodes in peripheries of openings of the through-holes on an upper surface of the cover;
- and
- forming conductive material in the through-holes and electrically connecting the IDT electrodes and the external electrodes.
Dependencies are inferred from the claim text.