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US 2006/0131760 A1Published application
Power semiconductor package
AssigneeInternational Rectifier Corporation
InventorsMartin Standing, Robert Clarke
Life of this patent
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Abstract
A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.
Claims28
A semiconductor package comprising:
- a semiconductor die that includes at least a first power electrode and a second power electrode;
- a first conductive clip electrically and mechanically coupled to said first power electrode;
- a second conductive clip electrically and mechanically coupled to said second power electrode;
- and
- a passivation body encapsulating at least said semiconductor die, wherein said passivation body is formed from a passivation material that is capable of protecting said semiconductor die without another housing element.
2 more elements
A semiconductor package comprising:
- a semiconductor die that includes at least a first power electrode and a second power electrode, each power electrode including a plurality of spaced power fingers;
- a first conductive clip electrically and mechanically coupled to said first power electrode;
- and
- a second conductive clip electrically and mechanically coupled to said second power electrode.
1 more element
Dependencies are inferred from the claim text.