Anchored non-solder mask defined ball pad
AssigneeSTMicroelectronics S.r.l.
InventorChristine Dao
Life of this patent
Estimating the term…
Abstract
A ball grid pad for connecting a ball grid array package to a printed circuit board includes a circular pad area adhered on a ball grid connection surface. A solder mask on the ball grid connection surface has an opening surrounding and spaced apart from the circular pad area. The ball pad includes an anchor trace on the ball grid connection surface wherein the ball pad conductor material extends radially from the edge of the circular pad area to a terminating point beyond the opening of the solder mask so that a portion of the anchor trace is covered by the solder mask. The ball grid connection surface may be an integrated circuit package substrate or a printed circuit board surface.
Claims20
A ball grid array substrate for a semiconductor device package comprising:
- a ball pad on a surface of the ball grid array substrate;
- a solder mask on the surface of the ball grid array substrate, wherein the solder mask has a solder mask opening that is larger than the ball pad and surrounds the ball pad;
- and
- an anchor trace on the surface of the ball grid array substrate that extends radially from the edge of the ball pad to a terminating point beyond the opening of the solder mask so that a portion of the anchor trace is covered by the solder mask.
A ball grid pad for connecting a ball grid array package to a printed circuit board, the ball grid pad comprising:
- a circular pad area on a ball grid connection surface;
- a solder mask on the ball grid connection surface, wherein the solder mask has an opening surrounding and spaced apart from the circular pad area;
- and
- an anchor trace on the ball grid connection surface that extends radially from the edge of the circular pad area to a terminating point beyond the opening of the solder mask so that a portion of the anchor trace is covered by the solder mask.
An integrated circuit in a ball grid array package, the integrated circuit comprising:
- a ball grid array package substrate having a die mounting surface and an opposing ball grid connection surface;
- an integrated circuit die mounted on the die mounting surface and electrically connected to a plurality of conductors on the ball grid array package substrate;
- a circular pad area on the ball grid connection surface, wherein the pad area is electrically connected to one of the plurality of conductors;
- a solder mask on the ball grid connection surface, wherein the solder mask has an opening surrounding and spaced apart from the circular pad area;
- and
- an anchor trace on the ball grid connection surface that extends radially from the edge of the circular pad area to a terminating point beyond the opening of the solder mask so that a portion of the anchor trace is covered by the solder mask.
Dependencies are inferred from the claim text.