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US 2006/0131748 A1Published application
Ball limiting metallurgy split into segments
OwnerKrishna Seshaninventor
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Abstract
The present invention discloses a novel layout and process for a device with segmented BLM for the I/Os. In a first embodiment, each BLM is split into two segments. The segments are close to each other and connected to the same overlying bump. In a second embodiment, each BLM is split into more than two segments. In a third embodiment, each segment is electrically connected to more than one underlying via. In a fourth embodiment, each segment is electrically connected to more than one underlying bond pad.
Claims9
-25. (canceled)
A device having I/O connections to a package or board comprising:
- a bond pad, said bond pad having two or more segments, and
- a wire lead attached to said segments.
A device having input/output connections comprising:
- a bond pad, said bond pad split into two or more segments;
- a passivation layer disposed over said segments;
- two or more vias disposed in said passivation layer to uncover each of said segments;
- and
- a wire lead disposed in said vias and over said segments.
2 more elements
Dependencies are inferred from the claim text.