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US 2006/0131747 A1Published application
Carrier with metal bumps for semiconductor die packages
OwnerRuben Madridinventor
Life of this patent
Estimating the term…
Abstract
A carrier for a semiconductor die package is disclosed. In one embodiment, the carrier includes a metal layer and a plurality of bumps formed in the metal layer. The bumps can be formed by stamping.
Claims24
A carrier for a semiconductor die package, the carrier comprising:
- (a) a metal layer;
- and
- (b) a plurality of bumps formed in the metal layer,
- wherein the carrier is for electrically coupling a semiconductor die to a circuit substrate.
1 more element
A semiconductor die package comprising:
- (a) a carrier comprising a metal layer, a die attach region, and a plurality of stamped bumps formed in the metal layer;
- and
- (b) a semiconductor die electrically coupled to the die attach region of the carrier.
20-28. (canceled)
A semiconductor die package comprising:
- a carrier comprising a metal layer, and a plurality of stamped, conical bumps formed in the metal layer;
- and
- a semiconductor die electrically coupled to the carrier.
Dependencies are inferred from the claim text.