Circuit device
AssigneeSanyo Electric Co., Ltd.
InventorsYasuhiro Kohara, Ryosuke Usui, Hideki Mizuhara, Yasunori Inoue
Life of this patent
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Abstract
A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.
Claims5
A circuit device comprising:
- a first insulating resin layer;
- a semiconductor chip provided on one surface of the first insulating resin layer;
- a conductive layer provided on another surface of the first insulating resin layer;
- an electrode for connecting the conductive layer to a circuit board;
- and
- a second insulating resin layer provided between the conductive layer and the circuit board to embed the electrode therein, wherein
- a side face of the semiconductor chip is covered with the first insulating resin layer.
Dependencies are inferred from the claim text.