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US 2006/0131744 A1Published application
Method and apparatus for providing a BGA connection having improved drop test performance
OwnerShawn O'Connor, Mark Gerber +1inventors
InventorsShawn O'Connor, Mark Gerber, Wyatt Huddleston
Life of this patent
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Abstract
A BGA (Ball Grid Array Structure) having improved drop test performance by increasing the area of the solder bond at the corner of the array using existing assembling machinery.
Claims13
A ball grid array (BGA) structure having improved drop test performance comprising:
- an electronic device having a multiplicity of conductive terminal pads formed on a surface of said electronic device for bonding with solder balls, said multiplicity of terminal pads arranged in a plurality of equally spaced rows and columns so as to form a rectangular shaped array and such that each corner of said array is defined by at least three terminal pads;
- an anchor pad on at least one corner of said array, said anchor pad comprising said at least three terminal pads and a conductive layer extending between and in contact with said three terminal pads;
- a support surface having a multiplicity of contact pads for bonding with solder balls, said multiplicity of contact pads arranged in a plurality of equally spaced rows and columns representing a mirror image array of said rectangular shaped array of terminal pads;
- an anchor pad on said support surface corresponding to said anchor pad on said electronic device, said support surface anchor pad comprising three contact pads and a conductive layer extending between and in contact with said three contact pads;
- a multiplicity of solder balls having a selected diameter electrically connecting and bonding together one each terminal pad on said array of terminals on said electronic device to one each contact pad on said support surface, each of said solder balls deforming substantially uniformly such that said surface of said electronic device is spaced parallel to and at a constant distance from said support surface;
- and
- an additional solder ball having said selected diameter bonded between said anchor pad on said electronic device and said anchor pad on said support surface, said additional solder ball equally spaced between the three solder balls bonding said three terminal pads and said three contact pads together at said at least one corner and wherein said additional solder ball and said three solder balls flow together to form a corner solder bond having increased size.
4 more elements
7-12. (canceled)
A ball grid array (BOA) structure having improved drop test performance comprising:
- an electronic device having a multiplicity of conductive terminal pads formed on a surface of said electronic device for bonding with solder balls, said multiplicity of terminal pads arranged in an array such that a corner of said array is defined by at least three terminal pads;
- an anchor pad on at least one corner of said array, said anchor pad comprising said three terminal pads and a conductive layer extending between and in contact with said three terminal pads;
- a support surface having a multiplicity of contact pads for bonding with solder balls, said multiplicity of contact pads arranged in a mirror image array of said array of terminal pads;
- an anchor pad on said support surface corresponding to said anchor pad on said electronic device, said support surface anchor pad comprising three contact pads and a conductive layer extending between and in contact with said three contact pads;
- a multiplicity of solder balls electrically connecting and bonding together terminal pads on said electronic device to contact pads on said support surface;
- and
- an additional solder ball bonded between said anchor pad on said electronic device and said anchor pad on said support surface, said additional solder ball equally spaced between the three solder balls bonding said three terminal pads and said three contact pads together at said at least one corner and wherein said additional solder ball and said three solder balls flow together to form a corner solder bond having increased size.
4 more elements
Dependencies are inferred from the claim text.