Semiconductor device and manufacturing method of the same

A method of manufacturing a semiconductor device, comprising:

• preparing a first semiconductor chip having a first electrode and an electrode connecting member attached to a tip of the first electrode;
• preparing a second semiconductor chip having a hole penetrating through the second conductor chip and a second electrode formed in the hole so as to leave a hollow space along a center of the hole;
• placing the first semiconductor chip and the second semiconductor chip so that the first electrode faces the second electrode;
• heating the electrode connecting member;
• and
• attaching the first electrode and the second electrode so that part of the heated electrode connecting member penetrates into the hollow space.

A method of manufacturing a semiconductor device, comprising:

• preparing a first semiconductor chip having a first electrode and an electrode connecting member attached to a tip of the first electrode;
• preparing a second semiconductor chip having a hole penetrating through the second conductor chip and a second electrode formed in the hole so as to leave a hollow space along a center of the hole;
• attaching a thermosetting resin to a surface of the first semiconductor chip having the first electrode thereon or a surface of the second semiconductor chip having the second electrode thereon;
• placing the first semiconductor chip and the second semiconductor chip so that the first electrode faces the second electrode;
• heating the electrode connecting member;
• and
• attaching the first electrode and the second electrode so that part of the thermosetting resin penetrates into the hollow space and part of the heated electrode connecting member penetrates into the hollow space.