Multi-level semiconductor module and method for fabricating the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTakeshi Kawabata, Motoaki Satou, Toshiyuki Fukuda, Toshio Tsuda, Kazuhiro Nobori, Seiichi Nakatani
Life of this patent
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Abstract
A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3. The resin board 4 located at the bottom out of the resin boards 3 is thicker than the other resin boards 3.
Claims18
A multi-level semiconductor module formed by alternately stacking resin boards and sheet members, each of the resin boards including one or more first buried conductors and having an upper face on which a semiconductor chip is mounted, each of the sheet members having an opening for accommodation of the semiconductor chip and including one or more second buried conductors electrically connected to the first buried conductors, wherein one of the resin boards located at the bottom has a thickness larger than that of each of the other resin board or boards.
A method for fabricating a multi-level semiconductor module, the method comprising the steps of:
- (a) preparing one or more first resin boards, a second resin board and one or more sheet members, each of the first resin boards having an upper face on which a semiconductor chip is mounted and including one or more first buried conductors, the second resin board having an upper face on which a semiconductor chip is mounted, including one or more first buried conductors and having a thickness larger than that of each of the first resin boards, each of the sheet members having an opening for accommodation of an associated one of the semiconductor chips and including one or more second buried conductors;
- (b) placing the second resin board at the bottom and alternately stacking the sheet members and the first resin boards over the second resin board;
- and
- (c) applying heat and pressure to the first and second resin boards and the sheet members stacked at the step (b) from the top and the bottom of the stacked structure so as to bond the first and second resin boards and the sheet members together and to connect the first buried conductors and the second buried conductors to each other.
A method for fabricating a multi-level semiconductor module, the method comprising the steps of:
- (a) preparing one or more first resin boards, a second resin board and one or more sheet members, each of the first resin boards having an upper face on which a semiconductor chip is mounted and including one or more first buried conductors, the second resin board having an upper face on which a semiconductor chip is mounted, including one or more first buried conductors and having a thickness larger than that of each of the first resin boards, each of the sheet members having an opening for accommodation of an associated one of the semiconductor chips and including one or more second buried conductors;
- (b) placing the second resin board at the bottom and alternately stacking the sheet members and the first resin boards over the second resin board;
- (c) placing a rigid plate having a thermal conductivity higher than that of each of the first and second resin boards over one of the first resin boards located at the top;
- and
- (d) applying heat and pressure to the stacked structure of the first and second resin boards, the sheet members and the rigid plate from the top and the bottom of the stacked structure so as to bond the first and second resin boards and the sheet members together and to connect the first buried conductors and the second buried conductors to each other, after the step (c) has been performed.
Dependencies are inferred from the claim text.