Semiconductor chip having coolant path, semiconductor package and package cooling system using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYun-Hyeok Im, Jae-Wook Yoo, Hee-Seok Lee
Life of this patent
Estimating the term…
Abstract
The present invention relates to a semiconductor chip coolant path, a semiconductor package utilizing the semiconductor chip coolant path, and a cooling system for the semiconductor package. For effective dissipation of heat generated during semiconductor chip operation, a semiconductor chip having a coolant path formed through or adjacent to its backside and a semiconductor package utilizing the semiconductor chip are provided. In addition, a cooling system for the semiconductor package circulates a coolant through the coolant path within the semiconductor package to directly contact and cool the semiconductor chip.
Claims41
A semiconductor chip comprising a coolant path of a designated depth formed from a back surface of the semiconductor chip opposite to an active surface having a plurality of electrode pads thereat.
A semiconductor package comprising:
- a semiconductor chip having a coolant path of a designated depth formed from a back surface of the semiconductor chip opposite to an active surface having a plurality of electrode pads thereon;
- a substrate hermetically sealed to the back surface of the semiconductor chip and including a plurality of substrate pads;
- at least one coolant tubule coupled to the coolant path;
- a plurality of bonding wires to electrically couple the electrode pads and the substrate pads;
- a plastic resin molding compound encapsulating the semiconductor chip, portions of the at least one coolant tubule, and the plurality of bonding wires;
- and
- an external interface terminal formed on a surface of the substrate.
A semiconductor package comprising:
- a semiconductor chip having a plurality of electrode pads on the active surface thereof;
- a substrate having an upper surface on which the back surface of the semiconductor chip is hermetically attachable, and a substrate coolant path formed to a designated depth in the upper surface and passing through the back surface of the semiconductor chip;
- a coolant tubule coupled to the substrate coolant path to circulate a coolant through the substrate coolant path;
- a plurality of bonding wires to electrically couple the electrode pads of the semiconductor chip with substrate pads of the substrate;
- a plastic resin molding compound encapsulating the semiconductor chip, at least a portion of the coolant tubule, and the plurality of bonding wires on the upper surface of the substrate, wherein first and second ends of the coolant tubule protrude from first and second side surfaces, respectively, of the molding compound;
- and
- an external interface terminal on the lower surface of the substrate.
A system for cooling a semiconductor package comprising:
- a semiconductor chip having a coolant path of a designated depth formed from a back surface of the semiconductor chip opposite to an active surface having a plurality of electrode pads thereon;
- a substrate hermetically sealed to the back surface of the semiconductor chip and including a plurality of substrate pads;
- at least one coolant tubule coupled to the coolant path;
- a plurality of bonding wires to electrically couple the electrode pads and the substrate pads;
- a plastic resin molding compound encapsulating the semiconductor chip, portions of the at least one coolant tubule, and the plurality of bonding wires;
- an external interface terminal formed on a surface of the substrate;
- a coolant reservoir;
- a coolant pipe connecting the coolant reservoir and the at least one coolant tubule to circulate coolant from the coolant reservoir through the coolant path back to the coolant reservoir;
- a heat exchanger cooling the coolant coming from the coolant path;
- and
- a pump installed at the coolant pipe to force the coolant to circulate.
A semiconductor package comprising:
- a substrate;
- and
- a semiconductor chip mountable to the substrate to form in cooperation therewith a coolant path including portions thereof bounded by the semiconductor chip.
In combination, an integrated circuit and a substrate, the integrated circuit at its back surface cooperative with the substrate to form a coolant path, each formed to contribute to containment of a coolant when passed along the coolant path and contact with the integrated circuit.
Dependencies are inferred from the claim text.