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US 2006/0131736 A1Published application
Package for a high-frequency electronic device
AssigneeKoninklijke Philips Electronics N.V.
InventorsAndreas Jansman, Ronald Dekker, Godefridus Hurkx, Wibo Van Noort, Antonius Lucien Kemmeren
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Abstract
The electronic device comprises a substrate (1) with a cavity (6) in which an active device (8) is present. On the first side (2) of the substrate an interconnect structure (17) extends over the cavity and the substrate. On the second side (3) of the substrate to which the cavity extends, a heat sink (23) is available. The device is particularly suitable for use at high frequencies, for instance higher than 2 GHz and under conditions of high dissipation.
Claims13
An electronic device comprising:
- a substrate of a semiconductor material having a first and a second opposite side, which is provided with a first through-hole extending from the first to the second side, the substrate being provided with a first electrical element on its first side;
- an active device having a coupling surface provided with connection pads, which device is present in the first through-hole of the substrate with its coupling surface on the first side of the substrate,
- a thin film interconnect structure being provided on the first side of the substrate extending over the first through-hole and interconnecting the active device with the electrical element, the interconnect structure comprising connection faces corresponding to the connection pads,
- a heat sink is present on the second side of the substrate extending over the first through-hole and at least part of the substrate, and
- bond pads for connection to an external system, characterized in that the active device is made to process signals of a first frequency, and the first electrical element is part of a transformer for transforming the signals of the first frequency to a second, lower frequency and/or vice versa, so that in operation the bond pads transmit signals at the second frequency and that the heat sink operates as a ground plane.
2 more elements
Dependencies are inferred from the claim text.